Sapphire wafer laser micromachining system
Sapphire wafer laser micromachining system
详细描述
Parameters / Model
TOL-YAG3015-500
TOL-YAG3015-600
Laser media
Nd: YAG
Nd: YAG
The maximum laser power
500W
7500W
Cutting range (length × width)
3000mm × 1500mm
3000mm × 1500mm
Maximum positioning speed
20m / min
30m / min
Maximum cutting speed
3m / min
4m / min
Repeat accuracy
± 0.02mm
± 0.02mm
Cooling
Water-cooled
Water-cooled
Pulse repetition frequency
0-300Hz
0-300Hz
The minimum line width
0.15mm
0.15mm
Cutting material thickness
0.2-8mm (steel)
0.2-10mm (steel)
Laser wavelength
1064nm
1064nm
Overall power consumption
≤18KW
≤20KW
Power Configuration
Phase four-wire 380V / ± 10% / 50Hz
Phase four-wire 380V / ± 10% / 50Hz
Continuous working time
24 hours
24 hours
Weight
About 3500kg
About 4000kg
Dimensions (L × W × H)
4500mm × 2500mm × 1500mm
4500mm × 2500mm × 1500mm